Xu Wei, PhD, is a high-level overseas talent of Shenzhen Peacock Program and a senior member of IEEE. He graduated from Huazhong University of Science and Technology in 2010 and 2013 with a bachelor's degree in engineering and a master's degree in engineering. He graduated from Hong Kong University of Science and Technology in 2017 with a doctorate. He joined the School of Electronic and Information Engineering of Shenzhen University in 2018 and is currently a tenured associate professor. His research interests mainly include CMOS-MEMS/MEMS integrated sensor chips and intelligent fusion systems. He has presided over and participated in many projects, including the National Natural Science Foundation of China, the HKUST-MIT Super Joint Project, the Guangdong Natural Science Foundation, the Ministry of Education's Overseas Scientific Research Cooperation Project, and the Peacock Program Scientific Research Project. In recent years, the university has published more than 80 papers in important international SCI journals such as IEEE JSSC, JMEMS, TIE, TIM, TED, IEEE SENS J, and top international conferences such as IEEE MEMS, IEEE Transducers, and IEEE Sensors. Among them, 3 IEEE JMEMS papers were selected for the JMEMS RightNow Paper Award, and one IEEE MEMS 2020 conference paper won the Best Paper Award (only three papers in the world, and this is the second time that a mainland university has won this award since the top international conference was held for more than 30 years).

[1]Ph.D.     Hong Kong University of Science and Technology     2013/08–2017/06

[2]M.S.     Huazhong University of Science and Technology     2010/09–2013/03

[3]B.S.     Huazhong University of Science and Technology     2006/09–2010/07

[1]Visiting Scholar in University of California, Berkeley, USA

Jun 2024–Present

[2]Associate Professor (Tenured) in Shenzhen University        

Jul 2023–Present

[3]Assistant Professor in Shenzhen University                  

Jul 2018–Jun 2023

[4]Visiting Scholar in HKUST                                        

Jul 2018–Jun 2019

[5]Research Associate for HKUST-MIT Joint Project              

Jul 2017–Jun 2018

[1]JMEMS RightNow Paper, IEEE Electron Devices Society               2024

[2]Director Award of State Key Laboratory of RFHI (Category B)          2023

[3]Outstanding Undergraduate Teaching Award                              2023

[4]Second Prize for Excellent Paper Award on IMMS 2023               2023

[5]IEEE MEMS 2023 Best Paper Award Nominee                              2023

[6]IEEE Senior Member                                                            2022

[7]IEEE ISCAS Best Paper Award Nominee                                   2022

[8]IEEE MEMS 2020 Best Paper Award                                        2020

[9]JMEMS RightNow Paper, IEEE Electron Devices Society               2020

[10]Outstanding Teacher, Shenzhen University                              2020

[11]Leading Talent in Nanshan District (Class C), Shenzhen           2019

[12]Shenzhen Overseas High-Level Talent (Class C), Shenzhen          2018

[13]JMEMS RightNow Paper, IEEE Electron Devices Society           2016

[1]Integrated CMOS-MEMS Sensor and Sensor Fusion System

[2]Flexible Wearable Sensors for IoT and Medical Application

[1]X. Song, L. Huang, Y. Lin, L. Hong and W. Xu*, "Surface Micromachined CMOS-MEMS Pirani Vacuum Gauge with Stacked Temperature Sensor," IEEE Journal of Microelectromechanical Systems, vol. 33, no. 2, pp. 274-281, 2024. (Highlighted as JMEMS RightNow Paper)

[2]W. Xu, L. Hong, X. Pan and Izhar, "Monolithically Integrated Bidirectional Flow Sensor and Stacked Temperature/Humidity Sensor based on CMOS-Compatible MEMS Technology," IEEE Transactions on Instrumentation and Measurement, vol. 73, pp. 1-9, pp. 7501609, 2024.

[3]W. Xu, Z. Li, Z. Fang, B. Wang, L. Hong, G. Yang, S. T. Han, X. Zhao, and X. Wang, "A Sub-5mW Monolithic CMOS-MEMS Thermal Flow Sensing SoC with ±6m/s Linear Range," IEEE Journal of Solid-State Circuits (JSSC), 2023, doi: 10.1109/JSSC.2023.3314765.

[4]W. Xu*, X. Wang, Z. Ke, and Y. K. Lee, “Bidirectional CMOS-MEMS Airflow Sensor with sub-mW Power Consumption and High Sensitivity,” IEEE Transactions on Industrial Electronics, vol. 69, no. 3, pp. 3183-3192, 2022.

[5]Izhar, W. Xu*, H. Tavakkoli, X. Zhao, and Y. K. Lee, "CMOS Compatible MEMS Multienvironmental Sensor Chip for Human Thermal Comfort Measurement in Smart Buildings," IEEE Transactions on Electron Devices, vol. 69, no. 11, pp. 6290-6297, 2022.

[6]W. Xu*, X. Wang, R. Wang, J. Xu, and Y.K. Lee*, “CMOS MEMS Thermal Flow Sensor with Enhanced Sensitivity for HVAC Application,” IEEE Transactions on Industrial Electronics, vol. 68, no. 5, pp. 4468-4476, 2021.

[7]W. Xu*, X. Wang, X. Zhao, Y. Yang, and Y. K. Lee, “Determination of Thermal Conductivities for Thin-Film Materials in CMOS MEMS Process,” IEEE Transactions on Instrumentation and Measurement, vol. 70, pp. 6001309, 2021.

[8]W. Xu, X. Wang, X. Zhao, and Y.K. Lee, “Two-Dimensional CMOS MEMS Thermal Flow Sensor with High Sensitivity and Improved Accuracy,” IEEE/ASME Journal of Microelectromechanical Systems, vol. 29, no. 2, pp. 248-254, 2020. (Highlighted as JMEMS RightNow Paper).

[9]W. Xu, S. Ma, X. Wang, Y. Chiu, and Y. K. Lee*, “A CMOS-MEMS Thermoresistive Micro Calorimetric Flow Sensor with Temperature Compensation,” IEEE Journal of Microelectromechanical Systems, vol. 28, no. 5, pp. 841-849, 2019.

[10]W. Xu, K. Song, S. Ma, B. Gao, Y. Chiu and Y. K. Lee, “Theoretical and Experimental Investigations of Thermoresistive Micro Calorimetric Flow Sensors Fabricated by CMOS MEMS Technology,” IEEE Journal of Microelectromechanical Systems, vol. 25, no. 5, pp. 954-962, Oct. 2016 (Highlighted as JMEMS RightNow Paper)

[11]K. Xiao, X. Song, M. Duan, and W. Xu*, “An Ultralow-Power Flexible Thermal Flow Sensor Based on Electrochemical Impedance” Transducers, pp. 694-697, 2023. (Top Conf., Oral)

[12]X. Song, K. Xiao, and W. Xu*, “A Low Power and Ultrathin Flexible Shear Stress Sensor with High Sensitivity Suspended Over a Flexible Substrate” Transducers, pp. 306-309, 2023. (Top Conf., Oral)

[13]L. Huang, Izhar, X. Zhou, M. Fang, S. Huang, Y. K. Lee, X. Pan, and W. Xu*, "A real-time wireless calorimetric flow sensor system with a wide linear range for low-cost respiratory monitoring," IEEE 36th International Conference on Micro Electro Mechanical Systems (MEMS), Munich, pp. 107-110, 2023. (Best Paper Award Nominee)

[14]Z. Li, Z. Fang, B. Wang, M. Ahmed, X. Pan, S. T. Han, X. Zhao, and W. Xu*, “System-Level Modeling and Design of a Temperature Compensated CMOS MEMS Thermal Flow Sensor,” IEEE International Symposium on Circuits and Systems, pp. 2072-2076, 2022. (Best Paper Award Nominee)

[15]X. Xu, Z. Fang, J. Zheng, B. Gao, and W. Xu*, “Theoretical and experimental studies of electrochemical impedance based micro calorimetric flow sensor,” The 21th International Conference on Solid-State Sensors, Actuators and Microsystems (Transducers), pp. 1223-1226, 2021.

[16]X. Wang, Y. Guo, X. Zhao, W. Xu*, “A Bidirectional CMOS MEMS Thermal Wall Shear Stress Sensor with Improved Sensitivity and Low Power Consumption,” IEEE 34rd International Conference on Micro Electro Mechanical Systems (MEMS), pp. 131-134, 2021. (Top Conf., Oral)

[17]Z. Fang, X. Xu, J. Zheng, L. Zhang, Y. Yang, and W. Xu*, “Micro Thermal Flow Sensor for Ion Solution Based on The Monitoring of Slope of Impedance Changes,” IEEE 34rd International Conference on Micro Electro Mechanical Systems (IEEE MEMS 2021), in press, 2021. (Top Conf., Oral)

[18]W. Xu*, X. Wang, X. Zhao, Z. Ke, and Y. K. Lee*, “An Integrated CMOS Mems Gas Flow Sensor with Detection Limit Towards Micrometer Per Second,” IEEE 33rd International Conference on Micro Electro Mechanical Systems (MEMS), Vancouver, Canada, pp. 200-203, 2020. (Best Paper Award, only three articles were selected internationally)

[19]W. Xu, M. Duan, M. Ahmed, S. Mohamad, A. Bermak, and Y. K. Lee, “A Low Cost Micro BTU Sensor System Fabricated by CMOS MEMS Technology”, in The 19th International Conference on Solid-State Sensors, Actuators and Microsystem (Transducers), Kaohsiung, Taiwan, Jun 18-22, 2017, pp. 406-409. (Top Conf., Oral)

[20]W. Xu, B. Gao, S. Ma, A. Zhang, Y. Chiu, and Y. K. Lee, “Low-cost Temperature-Compensated Thermoresistive Micro Calorimetric Flow (T2MCF) Sensor by Using 0.35µm CMOS MEMS Technology,” IEEE 29th International Conference on Micro Electro Mechanical Systems (MEMS), Shanghai, China, Jan. 2016, pp. 189-192. (Top Conf., Oral)

[1]National Natural Science Foundation of China (62474115, 2025-2028, 480,000 RMB)

[2]Independent Scientific Research Program of State Key Laboratory of Radio Frequency Heterogeneous Integration (Independent Scientific Research Program No. 2024013, 2024-2027, 150,000 RMB).

[3]Natural Science Foundation of Guangdong Province (2024A1515030026, 2024-2026, 300,000 RMB)

[4]Shenzhen Basic Research Key Project (JCYJ20220818095810023, 2022/11-2025/10, 2 Million RMB)

[5]National Natural Science Foundation of China (52105582, 2022-2024, 300,000RMB)

[6]Natural Science Foundation of Guangdong Province (2022A1515010894, 2022-2024, 100,000 RMB)

[7]Natural Science Foundation of Guangdong Province (2020A1515011555, 2019-2022, 100,000 RMB)

[8]Ministry of Education Project (202011020030, 2021, 50,000 RMB)

[9]Open Funding of the State Key Laboratory (DMETKF2021016, 2020-2022, 80,000 RMB)

[10]Shenzhen Basic Research General Project (JCYJ20210324095210030, 2021-2024, 600,000 RMB)

[11]Shenzhen High-end Talent Start-up Project (827-000451, 2020-2022, 3 million RMB)

[12]Shenzhen University Young Teachers Fund (85304-211, 2018-2022, 200,000 RMB)

Looking for Research Assistants and Postdoctoral Researchers in the field of MEMS Sensors. Interested candidates are invited to send their CVs to weixu@szu.edu.cn