许威，博士，深圳市孔雀计划海外高层次人才，IEEE高级会员。2010年和2013年毕业于华中科技大学，获工学学士与工学硕士学位。2017年毕业于香港科技大学，获博士学位。2018年加入深圳大学电子与信息工程学院，现任长聘副教授。研究方向主要包括CMOS-MEMS/MEMS集成传感芯片及智能融合系统。主持和参与国家自然科学基金、HKUST-MIT超大联合项目，广东省自然科学基金，教育部海外科研合作项目，孔雀计划科研项目等多项课题。近年来，在国际重要SCI期刊IEEE JSSC, JMEMS, TIE, TIM，TED, IEEE SENS J等以及顶级国际会议IEEE MEMS, IEEE Transducers和IEEE Sensors等发表论文80余篇，其中3篇IEEE JMEMS论文获选JMEMS RightNow论文奖，一篇IEEE MEMS 2020会议论文获最佳论文奖（全球仅三篇，系该国际顶级会议举办30余届以来，内地高校第二次荣获此奖项）。

ResearchGate学术主页：https://www.researchgate.net/profile/Wei_Xu163

Google Scholar学术主页：https://scholar.google.com/citations?user=XehX9rsAAAAJ&hl=en

1. CMOS-MEMS/MEMS集成传感芯片：包括流量、加速度、惯性、温湿度、麦克风、压力传感芯片及其 ASIC接口电路

 2. 柔性可穿戴智能传感器及人机交互：包括流量、压力、温湿度、汗液、热触觉等IoT系统

1. 广东省自然科学基金青年提升项目（2024A1515030026，2024/1-2026/12，30万元）

2. 深圳市基础研究重点项目 (JCYJ20220818095810023，2022/11-2025/10，200万元)

3. 国家自然科学基金青年项目 (52105582，2022/1-2024/12，30万元)

4. 广东省自然科学基金面上项目 (2020A1515011555，2019/10-2022/09，10万元）

5. 广东省自然科学基金面上项目 (2022A1515010894，2022/1-2024/12，10万元）

6. 教育部项目（202011020030, 2021/1-2021/12，5万元，结题)

7. 国家重点实验室开放课题 (DMETKF2021016, 2020-2022，8万元)

8. 深圳市基础研究面上项目 (JCYJ20210324095210030, 2021/10-2024/9，60万元)

9. 深圳市高端人才启动项目 (827-000451, 2020/1-2022/12，300万元)

10. 深圳大学青年教师基金 (85304-211，2018.01-2022.12，20万元)

11. 深圳大学教研项目 (860/000001021170，2020/10-2021/6，1万元，结题)

2024，IEEE JMEMS RightNow 论文（EDS协会）

2023，IEEE MEMS 2023最佳论文提名奖

2022，IEEE Senior Member

2022，IEEE电路与系统学会传感技术委员会委员

2022，TIM论文被《电子与封装》前沿报道

2021，深圳大学百篇优秀本科毕业论文指导老师奖

2020，“研材微纳杯”优秀论文征集三等奖

2020，深圳大学教师年度考核优秀

2020，IEEE JMEMS RightNow 论文（EDS协会）

2020，论文获IEEE MEMS 2020最佳论文奖（领域顶会，800多篇投稿，全球仅三篇，获奖率<0.4%）

2018，第九届亚太地区传感器与微纳米技术会议（APCOT2018）分会主席

2016，IEEE JMEMS RightNow 论文（EDS协会）

Journal Papers (*Corresponding Author, 按发表年份排列，遴选)

1. X. Song, L. Huang, Y. Lin, L. Hong and W. Xu*, "Surface Micromachined CMOS-MEMS Pirani Vacuum Gauge with Stacked Temperature Sensor," IEEE Journal of Microelectromechanical Systems, vol. 33, no. 2, pp. 274-281, 2024. (Highlighted as JMEMS RightNow Paper)

2. W. Xu, L. Hong, X. Pan and Izhar, "Monolithically Integrated Bidirectional Flow Sensor and Stacked Temperature/Humidity Sensor based on CMOS-Compatible MEMS Technology," IEEE Transactions on Instrumentation and Measurement, vol. 73, pp. 1-9, pp. 7501609, 2024.

3. W. Xu, Z. Li, Z. Fang, B. Wang, L. Hong, G. Yang, S. T. Han, X. Zhao, and X. Wang, "A Sub-5mW Monolithic CMOS-MEMS Thermal Flow Sensing SoC with ±6m/s Linear Range," IEEE Journal of Solid-State Circuits (JSSC), 2023, doi: 10.1109/JSSC.2023.3314765.

4. W. Xu*, X. Wang, Z. Ke, and Y. K. Lee, “Bidirectional CMOS-MEMS Airflow Sensor with sub-mW Power Consumption and High Sensitivity,” IEEE Transactions on Industrial Electronics, vol. 69, no. 3, pp. 3183-3192, 2022.

5. Izhar, W. Xu*, H. Tavakkoli, X. Zhao, and Y. K. Lee, "CMOS Compatible MEMS Multienvironmental Sensor Chip for Human Thermal Comfort Measurement in Smart Buildings," IEEE Transactions on Electron Devices, vol. 69, no. 11, pp. 6290-6297, 2022.

6. W. Xu*, X. Wang, R. Wang, J. Xu, and Y.K. Lee*, “CMOS MEMS Thermal Flow Sensor with Enhanced Sensitivity for HVAC Application,” IEEE Transactions on Industrial Electronics, vol. 68, no. 5, pp. 4468-4476, 2021.

7. W. Xu*, X. Wang, X. Zhao, Y. Yang, and Y. K. Lee, “Determination of Thermal Conductivities for Thin-Film Materials in CMOS MEMS Process,” IEEE Transactions on Instrumentation and Measurement, vol. 70, pp. 6001309, 2021.

8. W. Xu, X. Wang, X. Zhao, and Y.K. Lee, “Two-Dimensional CMOS MEMS Thermal Flow Sensor with High Sensitivity and Improved Accuracy,” IEEE/ASME Journal of Microelectromechanical Systems, vol. 29, no. 2, pp. 248-254, 2020. (Highlighted as JMEMS RightNow Paper).

9. W. Xu, S. Ma, X. Wang, Y. Chiu, and Y. K. Lee*, “A CMOS-MEMS Thermoresistive Micro Calorimetric Flow Sensor with Temperature Compensation,” IEEE Journal of Microelectromechanical Systems, vol. 28, no. 5, pp. 841-849, 2019.

10. W. Xu, K. Song, S. Ma, B. Gao, Y. Chiu and Y. K. Lee, “Theoretical and Experimental Investigations of Thermoresistive Micro Calorimetric Flow Sensors Fabricated by CMOS MEMS Technology,” IEEE Journal of Microelectromechanical Systems, vol. 25, no. 5, pp. 954-962, Oct. 2016 (Highlighted as JMEMS RightNow Paper)

Peer-reviewed Conference Papers (*Corresponding Author, 按发表年份排列，遴选)

1. K. Xiao, X. Song, M. Duan, and W. Xu*, “An Ultralow-Power Flexible Thermal Flow Sensor Based on Electrochemical Impedance” Transducers, pp. 694-697, 2023. (领域顶会，Oral)

2. X. Song, K. Xiao, and W. Xu*, “A Low Power and Ultrathin Flexible Shear Stress Sensor with High Sensitivity Suspended Over a Flexible Substrate” Transducers, pp. 306-309, 2023. (领域顶会，Oral)

3. L. Huang, Izhar, X. Zhou, M. Fang, S. Huang, Y. K. Lee, X. Pan, and W. Xu*, "A real-time wireless calorimetric flow sensor system with a wide linear range for low-cost respiratory monitoring," IEEE 36th International Conference on Micro Electro Mechanical Systems (MEMS), Munich, pp. 107-110, 2023. (Best Paper Award Nominee)

4. Z. Li, Z. Fang, B. Wang, M. Ahmed, X. Pan, S. T. Han, X. Zhao, and W. Xu*, “System-Level Modeling and Design of a Temperature Compensated CMOS MEMS Thermal Flow Sensor,” IEEE International Symposium on Circuits and Systems, pp. 2072-2076, 2022. (Best Paper Award Nominee)

5. X. Xu, Z. Fang, J. Zheng, B. Gao, and W. Xu*, “Theoretical and experimental studies of electrochemical impedance based micro calorimetric flow sensor,” The 21th International Conference on Solid-State Sensors, Actuators and Microsystems (Transducers), pp. 1223-1226, 2021.

6. X. Wang, Y. Guo, X. Zhao, W. Xu*, “A Bidirectional CMOS MEMS Thermal Wall Shear Stress Sensor with Improved Sensitivity and Low Power Consumption,” IEEE 34rd International Conference on Micro Electro Mechanical Systems (MEMS), pp. 131-134, 2021. (领域顶会，Oral)

7. Z. Fang, X. Xu, J. Zheng, L. Zhang, Y. Yang, and W. Xu*, “Micro Thermal Flow Sensor for Ion Solution Based on The Monitoring of Slope of Impedance Changes,” IEEE 34rd International Conference on Micro Electro Mechanical Systems (IEEE MEMS 2021), in press, 2021. (领域顶会，Oral)

8. W. Xu*, X. Wang, X. Zhao, Z. Ke, and Y. K. Lee*, “An Integrated CMOS Mems Gas Flow Sensor with Detection Limit Towards Micrometer Per Second,” IEEE 33rd International Conference on Micro Electro Mechanical Systems (MEMS), Vancouver, Canada, pp. 200-203, 2020. (MEMS顶会， Best Paper Award，全球仅三篇)

9. W. Xu, M. Duan, M. Ahmed, S. Mohamad, A. Bermak, and Y. K. Lee, “A Low Cost Micro BTU Sensor System Fabricated by CMOS MEMS Technology”, in The 19th International Conference on Solid-State Sensors, Actuators and Microsystem (Transducers), Kaohsiung, Taiwan, Jun 18-22, 2017, pp. 406-409. (领域顶会, Oral)

10. W. Xu, B. Gao, S. Ma, A. Zhang, Y. Chiu, and Y. K. Lee, “Low-cost Temperature-Compensated Thermoresistive Micro Calorimetric Flow (T2MCF) Sensor by Using 0.35µm CMOS MEMS Technology,” IEEE 29th International Conference on Micro Electro Mechanical Systems (MEMS), Shanghai, China, Jan. 2016, pp. 189-192. (MEMS顶会, Oral)