简介
罗讯，深圳大学电子与信息工程学院特聘教授，国家级领军人才、国家级青年人才；IEEE杰出青年工程师奖、IEEE MTT学会功勋奖获得者；爱思唯尔-斯坦福大学全球前2%顶尖科学家（终身/年度）。长期大数据电子与人工智能微系统，数字化射频/微波/毫米波集成电路，片上太赫兹通信，可重构无源电路与系统，智慧传感网络，生物微电子集成系统，多维集成封装等前沿科技与应用研究。主持国家基础加强重点研究项目（首席科学家）、国家自然科学基金重点项目、国家自然科学基金国际（地区）合作研究项目、国家重点研发计划重点专项（首席科学家）等国家级重要项目。近年来以第一作者及通讯作者身份发表期刊/会议论文180余篇，含IEEE JSSC、ISSCC近30篇，IEEE TMTT、IMS 50余篇，IEEE MWCL、RFIC、CICC、EDL/TED、TCAS-I/II 60余篇；授权专利60余件（含欧美专利20余件）。兼/曾任IEEE MWCL责任主编，IEEE OJSSCS副主编等，IEEE IMS国际会议技术委员会分委会主席，IEEE ISSCC、IMS、RFIC、CICC国际会议技术委员会委员，IEEE JSSC、TMTT等20多个SCI期刊审稿人，IEEE IWS、RFIT等国际会议技术委员会共同主席等。培育国家级领军人才、国家级青年人才6人。
主要研究方向
1.数字射频集成电路及其微系统集成
2.可重构生成式智能无源电路
3.多物理场异质异构集成封装
4.大数据电子与人工智能微系统
教育经历
2006-2011，电子科技大学，电路与系统，博士
2001-2005，电子科技大学，电子信息工程，学士
工作经历
2025-至今，深圳大学，特聘教授
2015-2025，电子科技大学，教授
2014-2015，代尔夫特理工大学，助理教授
2013-2014，代尔夫特理工大学，博士后
2010-2013，华为技术有限公司，项目经理、系统工程师
学术兼职
Track Editor, IEEE Microwave and Wireless Components Letters
Topic Editor, IEEE Journal of Microwaves
Guest Editor, IEEE Microwave Magazine
Associate Editor, IEEE Open Journal of Solid-State Circuits Society
MTT-TC-4 (Microwave Passive Components and Transmission Line Structures) Member, IEEE Microwave Theory and Techniques Society
MTT-TC-5 (Filters) Member, IEEE Microwave Theory and Techniques Society
MTT-TC-23 (Wireless Communications) Member, IEEE Microwave Theory and Techniques Society
Vice Chair, IEEE MTT-Society Chengdu Chapter
TPC Sub-Committee Chair, IEEE International Microwave Symposium
TPC Member, IEEE International Solid-State Circuits Conference
TPC Member, IEEE International Microwave Symposium
TPC Member, IEEE Radio Frequency Integrated Circuits Symposium
TPC Member, IEEE Custom Integrated Circuits Conference
TPC Chair, 2026 IEEE International Wireless Symposium
所获荣誉
个人（遴选）：
2024，国家级领军人才
2022，IEEE Outstanding Young Engineer Award
2022，IEEE MTT-Society Meritorious Service Award
2021，IEEE RFIC Best Student Paper Award
2016，中国侨界贡献奖（创新成果）
2015，国家级青年人才
指导学生（近五年遴选）：
2024-2025 IEEE SSC-Society Predoctoral Achievement Award
2024 IEEE MTT-Society Undergraduate Scholarship Award (Cycle I)
IEEE IMS2023 Best Student Design Competition Award
2023 IEEE MTT-Society Graduate Fellowship Award
2022-2023 IEEE SSC-Society Predoctoral Achievement Award
2022 IEEE MTT-Society Graduate Fellowship Award
2022 IEEE MTT-Society Undergraduate Scholarship Award
2021-2022 IEEE SSC-Society Predoctoral Achievement Award
2021 IEEE MTT-Society Graduate Fellowship Award
2020-2021 IEEE SSC-Society Predoctoral Achievement Award
IEEE RFIC2021 Best Student Paper Award
2021 IEEE MTT-Society Undergraduate Scholarship Award (Cycle II)
2021 IEEE MTT-Society Undergraduate Scholarship Award (Cycle I)
2020 IEEE MTT-Society Graduate Fellowship Award
2020 IEEE MTT-Society Undergraduate Scholarship Award
代表性项目
国家级项目（遴选）：
1. 国家重点研发计划重点专项，“数字化毫米波雷达芯片技术”，主持
2. 国家自然科学基金重点项目，“硅基宽频数字化微波/毫米波阵列发射系统芯片研究”，主持
3. 国家自然科学基金国际（地区）合作项目，“太赫兹高能效低抖动锁相频率源阵列芯片关键技术研究”，主持
4. 国家部委计划重点项目，“XXX射频前端”，主持
5. 国家部委计划重点项目，“XXX放大器”，主持
企业合作项目（遴选）：
1. 华为横向重点合作项目，“高频技术合作项目”，主持
2. 华为横向重点合作项目，“高频相位同步阵列系统芯片合作项目”，主持
3. 中微半导体横向重点合作项目，“数字射频微系统合作项目” ，主持
近5年代表性研究成果
期刊论文（遴选）：
1.Y. Shu and X. Luo, “Class-G impedance-modulation multi-core power oscillator for high Pout and power back-off efficiency enhancement,” IEEE J. Solid-State Circuits (JSSC), vol. 60, no. 7, pp. 2511–2521, Jul. 2025.
2.X. Luo, B. Yang, Z. Deng, W. Chen, Y. Shu, and J. Zhou, “A phased-array transceiver with 2-dimension continuously auto link-tracking operation and time division modulator,” IEEE J. Solid-State Circuits (JSSC), vol. 59, no. 8, pp. 2390–2406, Aug. 2024.
3.J. Zhou, B. Yang, Y. Shu, and X. Luo, “A phase-modulation phase-shifting phased-array transmitter with phase self-calibration and deep PBOs efficiency enhancement,” IEEE J. Solid-State Circuits (JSSC), vol. 59, no. 8, pp. 2362–2377, Aug. 2024.
4.H. Tang, H. Qian, B. Yang, and X. Luo, “A self-calibration SCPA with storage capacitor array supporting 64-/256-/1024-QAM,” IEEE J. Solid-State Circuits (JSSC), vol. 58, no. 5, pp. 1241–1255, May 2023.
5.Z. Deng, C. Han, Y. Li, H. Qian, and X. Luo, “A 23–40 GHz phased-array receiver using 14-Bit phase-gain manager and wideband noise-cancelling LNA,” IEEE J. Solid-State Circuits (JSSC), vol. 58, no. 3, pp. 647–661, Mar. 2023.
国际会议论文（遴选）：
1.H. Tang, B. Yang, and X. Luo, “A 4.7GHz, 27.7dBm Pout, 37.8% PAE, 5.8° AM-PM distortion polar SCPA using in-cell fast slope-to-phase self-calibration and asymmetrical 4-to-1 differential power-combining transformer,” in IEEE ISSCC, San Francisco, CA, USA, Feb. 2025.
2.D. Tang, B. Yang, A. Han, and X. Luo, “A 56-to-64GHz linear power amplifier with 30.2dBm Psat and 23.5% PAEpeak using scalable matched-zone-expanding radial power combining with EM-loss reduction in 40nm bulk CMOS,” in IEEE ISSCC, San Francisco, CA, USA, Feb. 2025.
3.Y. Shu, Z. Deng, and X. Luo, “A 28GHz scalable inter-core-shaping multi-core oscillator with DM/CM-configured coupling achieving 193.3dBc/Hz FoM and 205.5dBc/Hz FoMA at 1-MHz offset,” in IEEE ISSCC, San Francisco, CA, USA, Feb. 2023.
4.C. Han, J. Zhou, Z. Deng, Y. Shu, and X. Luo, “A 4.8dB NF, 70−86GHz deep-noise-canceling LNA using asymmetric compensation transformer and 4-to-1 hybrid-phase combiner in 40-nm CMOS,” in IEEE ISSCC, San Francisco, CA, USA, Feb. 2023.
5.B. Yang, Z. Deng, H. Qian, and X. Luo, “71–89GHz 12Gb/s double-edge-triggered quadrature RFDAC with LO leakage suppression achieving 20.5dBm peak output power and 20.4% system efficiency,” in IEEE ISSCC, San Francisco, CA, USA, Feb. 2023.
