1. Y. Jiang, Richard X.-K. Gao, “Compact quasi-static PEEC modeling of electromagnetic problems with finite dielectrics”, IEEE Trans. Microw. Theory Techn., vol. 71, no. 6, pp. 2373-2383, June 2023. (中科院一区)
2. Y. Jiang, W.J. Zhao, Richard X.-K. Gao, E.-X. Liu, and CE. Png, “A Full-wave Generalized PEEC Model for Periodic Metallic Structure with Arbitrary Shape”, IEEE Trans. Microw. Theory Techn., Sept. 2022. (中科院一区)
3. Y. Jiang, Y. Dou, and K.-L. Wu, “Generalized PEEC model for conductor-dielectric problems with radiation effect”, IEEE Trans. Microw. Theory Techn., vol. 68, no. 1, pp. 27-38, Jan. 2020. (中科院一区)
4. Y. Jiang and K.-L. Wu, “Quasi-static surface-PEEC modeling of electromagnetic problems with finite dielectrics”, IEEE Trans. Microw. Theory Techn., vol. 67, no. 2, pp. 565–576, Feb. 2019. (中科院一区)
5. Y. Jiang and Y. Dou, “PEEC Model Based on a Novel Quasi-static Green’s Function for Two-dimensional Periodic Structures”, IEEE J. Multiscale Multiphysics Comput. Tech., vol. 8, pp. 187-194, 2023.
6. Y. Jiang and R. X. -K. Gao, "A PEEC-informed Deep Learning Approach for Inverse Electromagnetic Problem in Heterogeneous Integrations," 2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI), Grand Rapids, MI, USA, pp. 740-745, 2023.
7. Y. Jiang and X. K. Gao, “A Novel Circuit Modeling Approach for Electromagnetic Black-Box Problems Based on Generative Adversarial Networks and Partial Element Equivalent Circuit Method”, 2022 Asia-Pacific International Symposium on Electromagnetic Compatibility, May, 2022. (获奖文章)
8. Y. Jiang and X. K. Gao, "A Deep Learning Based Macro Circuit Modeling for Black-box EMC Problems", EMC/SI/PI and EMC Europe Symposium 2021 IEEE International Joint, pp. 64-67, Jul. 2021
9. Y. Jiang and K.-L. Wu, "PEEC Model for Finite Dielectric Electromagnetic Problems”, 2020 IEEE International Conference on Computational Electromagnetics (ICCEM), Singapore, 2020. (Invited Talk)
10. Y. Jiang, Y. Dou, and K.-L. Wu, "Model order reduction of quasi-static PEEC model including dielectrics”, 2019 IEEE MTT-S International Conference on Numerical Electromagnetic and Multiphysics Molding and Optimization (NEMO), Boston, 2019.